Lattice Semiconductor introduces a new embedded vision development kit

     Lattice Semiconductor, a leading provider of customized intelligent interconnect solutions to the market, announced the launch of a new embedded vision development suite that is the first optimized for mobile-related systems that require flexible, low-cost, low-power image processing architectures. This unique solution is a modular platform that uses Lattice FPgas, ASSP, and programmable ASSP (pASSP) devices to provide the best balance of flexibility and low power consumption for a wide range of embedded vision solutions in the industrial, automotive, and consumer electronics markets.

     This new embedded vision development kit leverages Lattice's intelligent Interconnect and accelerated product family to provide customers with fully integrated solutions that can be used to design and develop and accelerate the time-to-market process. This innovative solution uses CrossLinkpASSP mobile bridging devices, low power and small size ECP5 FPGas, and high bandwidth, high-definition resolution HDMI ASSP products to accelerate the development of intelligent visual edge applications.

     In order to fully realize and leverage the value of iot and intelligent edge applications, data-intensive processing applications are moving from the core network to the edge network, and IDC's market research results show that this trend will expand further. Market analyst firm IDC expects the intelligent systems market revenue to exceed $2.2 trillion in 2020.

     Deepak Boppana, Director of product Marketing at Lattice Semiconductor, said: "As edge applications continue to become more intelligent, more and more applications will require integrated embedded vision technology. Our embedded vision development kit accelerates the adoption of mobile-related technologies, including machine vision, intelligent surveillance cameras, robotics, AR/VR, drones and advanced driver assistance systems (ADAS)."

     The CrossLink tablet includes dual high-definition (HD) cameras that support the MIPI CSI-2 interface without the need for an external video source. The ECP5 baseboard enables low power pre/post processing and includes Helion Vision's high definition image signal Processing (ISP) IP support. The development board also includes a NanoVesta connector to support external image sensor video input. The HDMI output board is based on the Sil1136 non-HDCP version of the device and can be connected to the standard HDMI display.