Infineon Technologies presents the latest generation of PrimePACK power modules that take advantage of Infineon's new IGBT generation

     Infineon Technologies AG introduces the latest generation of PrimePACK power modules that take advantage of Infineon's new IGBT generation. IGBT5 and innovative. The combination of XT technology is an important milestone in the development of IGBT chip and module technology. IGBT5 reduces static and dynamic power losses and increases power density while. XT module process technology extends product life through enhanced thermal management and power cycle cycles. As a result, the new PrimePACK module is the best choice for most high-power inverters for applications such as wind power, photovoltaic and industrial transmission.

     The new PrimePACK power module uses Infineon's latest IGBT5 chip, which increases its maximum working junction temperature (Tvjop) by 25K to 175°C. Compared to the previous generation, IGBT5 chip has better soft switching performance and lower total power loss. This increases the power density of systems using 1200V and 1700V power modules. As a result, the output current of the system can be increased by up to 25% while maintaining the same PrimePACK installation size.

     The Infineon.XT module process further enhances the performance of the mature PrimePACK, enabling it to meet the customer's requirements for product life today and in the future. This is because Infineon uses the IGBT chip and diode sintering process, while using copper bonding wire instead of aluminum bonding wire to improve the bonding performance of the system. Target system applications benefit from increased system availability due to a tenfold increase in PrimePACK module life.

     Infineon uses IGBT5 and IGBT5 in PrimePACK modules. XT technology allows system designers to gain greater freedom. With the new IGBT5-equipped PrimePACK, designers can increase the output power of an application by 25% or extend the life of the product tenfold while maintaining the same output current. While keeping the output power constant, the requirements of the cooling design can be greatly reduced, in addition, it can have a more powerful system overload capacity. Designers can choose between increasing output power or extending product life. Thanks to the increased design flexibility, designers can choose the best solution for most system applications.