IXYS introduces a new power module

     IXYS, a leader in power semiconductor and HVIC technology for power conversion, motor control, and energy efficient products used in medical and transportation applications, has expanded its IGBT module family on two new platforms, the 34 mm and 62 mm modules. The new home represents a small power platform copper baseplate technology that provides optimal high power density and excellent thermal conductivity. These modules are optimized for the phase leg configuration with industry-standard profiles, including IXYS 'latest generation IGBT X2PT and Sonic continuous current diode technology. This combination allows the best of both worlds, traditional packaging and the latest silicon technology to address the art of high-performance power control applications in state.

     The first available 34mm wide modules are the XPT 100A 650V rated phase leg (MIXA100PF650YI) and the X2PT 200A 1200V phase leg (MIXG200PF1200YI). These will be followed by 62mm profiles, the first available as the XPT MIXA300PF1200TLP and the X2PT MIXG450PF1200TLP are also in phase leg configurations. The 1200V XPT module portfolio will be expanded to include the latest X2PT technology in the 1700V rating as well as other circuit configurations.

     "With our broad line of bipolar input modules and isolated and unisolated IGBT driver IC solutions, we offer the broadest portfolio of complete materials for power systems in the Act. The driver IXYS can use our extensive Zilog MCU line to enable intelligent digital power management for power conversion, motor control and the car also to be controlled, "commented Dr. Nathan Zommer, founder, CEO and Chief Technology Officer of IXYS.

     "With our continuous investment in technology, we are committed to providing our customers with energy efficient solutions for power and motor control applications," commented Neil Lejeune, Vice President of Sales and Business Development for Europe. "These new Outlines will enable us to deliver optimally efficient devices into new and existing applications, allowing our customers to offer a package of semiconductor solutions to the market."