Design flexibility and simplified system integration with new current sensors

     Molex announced that the sensing current sensor will meet the growing demand for high-precision busbar current sensing solutions in industrial and automotive applications. The current sensor uses Infineon's high-precision coreless current sensor and Molex's unique proprietary electronic packaging technology to further reduce the size and weight of the sensor, while greatly simplifying installation and system integration.

     These current sensors are available for industrial and automotive grade options, including fully differential and single-ended output modes as well as bidirectional sensing. Available current ranges from +/-450A to +/- 1600a; Operating temperature range from -40℃ to 125℃, in line with AEC-Q100 Class 1 standard.

     "The new sensing current sensor, thanks to Infineon's coreless sensor and our proprietary electronic packaging technology, sets new standards for current sensing accuracy, reliability and integration simplicity," said Lily Yeung, Director of sensors for Innovative Solutions for Transportation at Molex. "Together, we can save our customers valuable space and optimize product performance while reducing the complexity and cost of major design and manufacturing."

     The sensor's compact, coreless design and unique electronic package result in a solution that is 86 percent lighter and half the size of competing current sensors. This allows for high-density packaging within the device, contributing to overall system weight reduction while enabling greater design flexibility.

     The company's current sensors offer more sensing opportunities in space-constrained applications and EMI sensitive applications. They also provide accuracy within 2% over a wide temperature range and the entire product life range, while having low sensitivity and offset errors. In addition, Infineon's differential Hall effect sensors are designed to suppress noise generated by stray magnetic fields, which are commonly found in demanding industrial motor drives and automotive applications.

     "Infineon's XENSIV TLE4973 and TLE4972 are part of our family of high-precision coreless magnetic current sensors that measure from 0A to 2000A, providing great flexibility for different power ranges. When combined with Infineon's sensors, Molex's innovative packaging creates a small, efficient and powerful solution for the automotive and industrial markets, "said Matthias Grewe, Vice President of Technology and Head of Product Line Magnetic Induction at Infineon.

     The company's proprietary electronic packaging technology seamlessly integrates high-current conductors, connectors, PCBS, bus bars, heat sinks and other mechanical components into a single device. This capability is ideal for components that must withstand high temperatures, high currents and harsh environments. Sensing current sensors use this proprietary packaging approach to ensure flexible system integration and improved accuracy from precise chip placement and factory calibration. The pre-calibration system makes installation simpler and more streamlined, and greatly reduces assembly time.

     This novel packaging technology uses 99% less water than typical PCB manufacturing, does not require any chemicals or generate copper sludge, and promotes a more environmentally friendly manufacturing method. Versatile and configurable design options, including sensor bus design, provide customers with a complete plug and play deployment package that does not require excessive development time, resources or cost.