Bourns introduces the industry's latest ultra-thin FLAT GDT gas discharge tube

     Bourns introduces a new thin bipolar gas discharge tube - FLAT GDT 2017 series with an innovative flat package and horizontal circuit design for telecommunications and industrial communication equipment, surge protection devices and circuit board assembly to meet today's high-density, space-constrained applications and more sensitive overvoltage protection requirements. Compared to a normal 8mm Bourns gas discharge tube, the new device saves 75% of the volume and can also vertically place twice as many FLAT GDT 2017 units on the board space of a conventional 8mm gas discharge tube. It is a breakthrough development in the volume and space saving of circuit protection design.

     In addition to reducing height and volume, Bourns innovative thin gas discharge tubes maintain their high isolation and current resistance under overvoltage. The FLAT GDT 2017 offers excellent surge current ratings, low leakage current and low insertion loss, while capacitance values remain constant at different voltages. In addition, signal and system operation are not interfered with, and optimized product reliability and performance meet the requirements of today's complex electronic devices.

     Kurt Wattelet, Product Manager at Bourns, said: "The Bourns FLAT GDT 2017 not only retains the characteristics of traditional gas discharge tubes, but also significantly saves valuable printed circuit board space, helping to solve the space problem of high-density application design. "The Bourns engineering team used a unique isolation path - the axial construction of the 'extruded' GDT - to reduce the height and volume of the product compared to conventional GDT, setting a new standard for miniaturized circuit protection design."

     The FLAT GDT 2017 series is ITU K.12 Class III compliant, with a rated current of 10 kA (8/20 μs waveform) and a DC breakdown voltage range of 90 to 500 V, and is available in a variety of package options, including horizontal (soldable to circuit backplane), vertical surface mount package, and vertical surface mount package. There are also pin-free packages for cassette or clamp applications, increasing customer design flexibility.