A new generation of photoelectric package micro-thermoelectric cooler series

     Laird Thermal Systems has introduced the OptoTEC™MBX series, a family of miniature thermoelectric coolers for high-performance space-confined optoelectronics applications. Utilizing next-generation thermoelectric materials and advanced process automation, the MBX series offers new configurations integrated into TO-Can, TOSA and Butterfly packages. The latest design innovations include a compact footprint, with the smallest models measuring just 1.5mm x 1.1mm and profiles as thin as 0.65mm, ensuring excellent cooling performance with the lowest possible power consumption within the given space constraints.

     The series offers high heat pump densities up to 43W/cm2, temperature differences up to 82C, and ambient temperatures up to 50C. The series ensures efficient thermal management and precise temperature stabilization, protecting optoelectronics that operate in high temperature environments, including laser diodes, optical transceivers, liDAR, infrared sensors and high power InP VCsels.

     Andrew Dereka, Director of Thermoelectric Products at Laird Thermal Systems, said: "Advances in the optical communications industry, driven by applications such as artificial intelligence and machine learning, require exceptional temperature stability for laser diodes in high-speed optical transceivers. The MBX series is the ideal solution to ensure that optical devices maintain consistent wavelengths, reduce crosstalk and extend service life. Our significant investment in high-precision automated production lines reflects our commitment to process control, high capacity and reliability."

     The series has been rigorously tested for Telcordia GR-468 CORE qualification, providing excellent reliability and long service life even in harsh environments to meet the highest qualification and reliability standards in the optoelectronics market. The MBX series can be designed to order with a unique form factor, heat pump density and power efficiency. With solder construction supporting reflux temperatures up to 280C and wire bonding attachments, the series is suitable for a wide range of optoelectronic applications. The company also offers special finishing options, including gold-plated patterns, thermistor attachments and seals to accommodate non-sealed packaging.