Technology Articles

2017-10 Sensors ams

[Oct 11 2017] Ams has announced the introduction of the AS5172AVB magnetic position sensor with a two-wire PSI5 interface for fast and secure transmission of precise rotating position measurement data. The new AS5172A and AS5172B system-on-chip (SoC) are 360-degree non-contact rotating magnetic position sensors that provide 14-bit high-resolution absolute Angle measurement. The sensors were developed as SEooC ...

2017-10 Semiconductors ON Semiconductor

[Oct 10 2017] ON Semiconductor, driving energy efficient innovation, has introduced two new highly integrated 1 megapixel (Mp)CMOS image sensing products, advancing the company's significant advances in the fast-growing automotive imaging field. The complete solution offered by the new device integrates image sensors and processing functions in a low-power system-on-a-chip (SoC) to simplify and accelerate adop ...

2017-10 Sensors Renesas Electronics America

[Oct 9 2017] Intersil, a subsidiary of Renesas Electronics, announced the ISL95338, the industry's first step-boost regulator for tablets, ultrabooks, mobile power supplies and other mobile devices using a reversible USBType-C4 connector. The new bidirectional regulator accepts a wide range of DC power inputs, including AC/DC power adapters, USB PD3.0 ports, travel power adapters, mobile power supplies, and m ...

2017-10 Semiconductors STMicroelectronics

[Oct 8 2017] STMicroelectronics, a leading global semiconductor supplier across multiple electronic applications and a member of the LoRaAlliance, and Objenious, a founding member of the LoRaAlliance and the first French telecom operator to offer LoRa network services nationwide, announced a technical collaboration. Accelerate the connection of iot (loT) nodes to the LoRa network. The ST Development Kit, cert ...

2017-10 Semiconductors STMicroelectronics

[Oct 7 2017] STMicroelectronics drives the global wave of intelligent power use and management with the introduction of a new modular Powerline Communications (PLC) modem chipset. The new chipset is ready standby manufacturers can flexibly design electricity meters, smart grid node street lights, home controllers, industrial controllers, and this new product is currently used by three smart meter manufacturer ...

2017-10 Passive Components Infineon Technologies

[Oct 6 2017] Infineon Technologies AG introduces the sixth generation 650 V CoolSiCTM Schottky diode, the latest addition to the CoolSiC diode product family. It builds on the distinctive characteristics of fifth-generation products to ensure reliability, quality and efficiency. The CoolSiC G6 diode is the perfect complement to the 600 V and 650 V CoolMOSTM 7 product family. They target current and future ser ...

2017-10 Connectors Vishay

[Oct 5 2017] Vishay Intertechnology has announced the launch of a new series of surface mount TMBS Trench MOS Barrier Schottky rectifiers in the SlimDPAK(TO-252AE) package from the eSMP family. Vishay General Semiconductor rectifiers are thinner than other DPAK(TO-252AA) packaged devices, and have better heat dissipation, reverse voltages from 45V TO 150V, lower forward conduction voltages, and higher current ...

2017-10 Semiconductors KEMET

[Oct 4 2017] KEMET, the world's leading supplier of electronic components, has announced the launch of its KPS MCC C0G high temperature 200°C large capacitor solution for harsh environment applications. Developed by combining Kimi Electronics' patented stable C0G/NPO base metal electrode (BME) dielectric system with durable lead | wire frame technology, these capacitors are ideally suited for high temperature ...

2017-10 Semiconductors STMicroelectronics

[Oct 4 2017] STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, has released a new Bluetooth software development tool that enables developers to use the latest Bluetooth wireless networking technology to develop smart connected products and drive innovation in the next generation of mobile phone-controlled products. The Bluetooth Technology Alliance (SIG) ...

2017-10 Semiconductors ON Semiconductor

[Oct 3 2017] Driving energy efficient innovation, ON Semiconductor introduces a new programmable RF transceiver System-on-chip package (SiP) that integrates an advanced RF system single-chip (SOC) with all surrounding bill of materials, including a thermocooled crystal oscillator TCXO. AX-SIP-SFEU offers the most integrated Sigfox solution for both upstream (send) and downstream (receive) communications. This ...

2017-10 Passive Components Littelfuse

[Oct 3 2017] Littelfuse announced the launch of the 0.9pF +30kV distributed unidirectional Transient Suppression Diode Array (SPA@ diode) family. The SP3222 series transient suppression diode array combines a low capacitance rail to rail diode with an additional Zener diode diode to protect electronic devices from destructive electrostatic discharge (ESD). This powerful - electrode is AEC-Q101 compliant and s ...

2017-10 Semiconductors Microchip Technology

[Oct 2 2017] Microchip Technology announced the launch of PAC1934, a high-precision power and energy monitoring chip that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system. On battery-powered Windows10 devices, the measurement accuracy is up to 99%. Microchip's PAC 1934 and Windows 10 drivers, combined with Microsoft's E3 service, improved battery usage meas ...