Interface - Telecom
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CategorySemiconductors / Interface ICs / Interface - Telecom
Records 3,109
Page 34/104
Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Function | Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA |
8,352 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
|
|
|
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP |
4,176 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
|
|
IDT, Integrated Device Technology |
IC LIU T1/E1/J1 16CH SH 484BGA |
3,060 |
|
- | Line Interface Unit (LIU) | E1, J1, T1 | 16 | 1.8V, 3.3V | - | 2.89W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-FPBGA (19x19) |
|
|
|
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15 |
5,562 |
|
- | SONET/SDH | Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
|
|
|
Microchip Technology |
10GBE WAN/LAN/BACKPLANE XAUI TO |
6,120 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
28-PORT LAYER 2 STACKABLE MANAGE |
5,256 |
|
E-StaX-III-28 | Ethernet Switch | - | 1 | - | - | - | - | Surface Mount | 672-BBGA, FCBGA | 672-FCBGA (27x27) |
|
|
|
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256LQFP |
6,930 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
|
|
IDT, Integrated Device Technology |
IC LIU T1/E1/J1 16CH SH 484BGA |
8,892 |
|
- | Line Interface Unit (LIU) | E1, J1, T1 | 16 | 1.8V, 3.3V | - | 3.10W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-FPBGA (19x19) |
|
|
|
Microchip Technology |
IC DGTL SWITCH 4K X 2K 256MQFP |
6,156 |
|
- | Switch | - | 1 | 3V ~ 3.6V | 480mA | - | -40°C ~ 85°C | Surface Mount | 256-BQFP | 256-MQFP (28x28) |
|
|
|
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA |
7,470 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
|
|
|
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP |
1,873 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
|
|
IDT, Integrated Device Technology |
IC LINE INTERFACE UNIT 208BGA |
6,192 |
|
- | Line Interface Unit (LIU) | LIU | - | 3.13V ~ 3.47V | - | - | -40°C ~ 85°C | Surface Mount | 208-BGA | 208-PBGA (17x17) |
|
|
|
IDT, Integrated Device Technology |
IC LINE INTERFACE UNIT 416BGA |
2,016 |
|
- | Line Interface Unit (LIU) | Parallel, Serial | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 416-BGA | 416-PBGA (27x27) |
|
|
|
Microchip Technology |
10GBE DUAL CHANNEL WAN/LAN XAUI |
663 |
|
- | Transceiver | Serial | 1 | 1.2V ~ 3.3V | - | 1W | - | Surface Mount | 196-LBGA, FCBGA | 196-FCBGA (15x15) |
|
|
|
MaxLinear, Inc. |
IC LIU E3/DS3/STS-1 4CH 144LQFP |
3,384 |
|
- | Line Interface Unit (LIU) | LIU | 4 | 3.135V ~ 3.465V | 500mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (20x20) |
|
|
|
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN |
4,734 |
|
- | Driver | - | 1 | -5.5V ~ -4.9V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
|
|
|
IDT, Integrated Device Technology |
IC LIU E1 21+1CH SHORT 640BGA |
2,232 |
|
- | Line Interface Unit (LIU) | LIU | - | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-TEPBGA (31x31) |
|
|
|
Microchip Technology |
IC VOICE ECHO CANCELLER 100LQFP |
6,318 |
|
- | Echo Cancellation | LIU | 1 | 1.6V ~ 2V | 40mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
|
|
|
IDT, Integrated Device Technology |
IC LIU T1/E1/J1 16CH SH 484BGA |
2,142 |
|
- | Line Interface Unit (LIU) | E1, J1, T1 | 16 | 1.8V, 3.3V | - | 2.89W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-FPBGA (19x19) |
|
|
|
IDT, Integrated Device Technology |
IC LIU E1 21+1CH SHORT 640BGA |
2,664 |
|
- | Line Interface Unit (LIU) | LIU | - | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-TEPBGA (31x31) |
|
|
|
Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT |
8,064 |
|
E-StaX-III-48 | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
10GBE SNGL XFI TO DUAL XAUI XCVR |
6,372 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 256-CSBGA |
7,416 |
|
- | Line Interface Unit (LIU) | LIU | 16 | 3.135V ~ 3.465V | 500mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
|
|
|
Microchip Technology |
11-PORT CE SWITCH |
148 |
|
Serval™-1 | - | - | - | - | - | - | - | - | - | - |
|
|
|
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN |
7,560 |
|
- | Driver | - | 1 | -5.5V ~ -4.9V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
|
|
|
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN |
447 |
|
- | Driver | - | 1 | -5.5V ~ -4.9V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
|
|
|
Microchip Technology |
10GBE DUAL XFI TO XAUI XCVR W/ED |
3,744 |
|
- | Transceiver | Serial | 1 | 1.2V ~ 3.3V | - | 1W | - | Surface Mount | 196-LBGA, FCBGA | 196-FCBGA (15x15) |
|
|
|
Microchip Technology |
IC DGTL SWITCH F8KDX 196BGA |
3,598 |
|
- | Switch | - | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 196-BGA | 196-PBGA (15x15) |
|
|
|
Microchip Technology |
33 CHANNEL T1/E1 FRAMER |
8,856 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP |
3,744 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |