Embedded Processors & Controllers

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Microcontroller, Microprocessor, FPGA Modules (903)
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Records 108,692

Page 3620/3624

Part Number	Description	In Stock
XCZU5EV-2FBVB900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock8,244
XCZU5EV-2FBVB900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,842
XCZU5EV-2SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock7,632
XCZU5EV-2SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock3,562
XCZU5EV-3FBVB900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock8,784
XCZU5EV-3SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock7,938
XCZU5EV-L1FBVB900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock8,946
XCZU5EV-L1SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock5,040
XCZU5EV-L2FBVB900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock3,240
XCZU5EV-L2SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock3,258
XCZU6CG-1FFVB1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock3,366
XCZU6CG-1FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock3,261
XCZU6CG-1FFVC900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock8,766
XCZU6CG-1FFVC900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock8,964
XCZU6CG-2FFVB1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock4,932
XCZU6CG-2FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock8,586
XCZU6CG-2FFVC900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock7,884
XCZU6CG-2FFVC900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,968
XCZU6CG-L1FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock4,536
XCZU6CG-L1FFVC900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock3,996
XCZU6CG-L2FFVB1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock4,590
XCZU6CG-L2FFVC900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock3,598
XCZU6EG-1FFVB1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock8,478
XCZU6EG-1FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock6,138
XCZU6EG-1FFVC900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock2,142
XCZU6EG-1FFVC900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock7,218
XCZU6EG-2FFVB1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock7,002
XCZU6EG-2FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock7,560
XCZU6EG-2FFVC900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,716
XCZU6EG-2FFVC900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock5,652

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