XCZU7EV-2FFVC1156I
For Reference Only
| Part Number | XCZU7EV-2FFVC1156I |
| PNEDA Part # | XCZU7EV-2FFVC1156I |
| Description | IC SOC CORTEX-A53 1156FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 4,104 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 23 - Nov 28 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XCZU7EV-2FFVC1156I Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XCZU7EV-2FFVC1156I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XCZU7EV-2FFVC1156I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
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Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 25K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
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Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 660K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FBGA, FC (40x40) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 50K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 400-LFBGA Supplier Device Package 400-VFBGA (17x17) |
