XCZU7EV-1FBVB900I
For Reference Only
| Part Number | XCZU7EV-1FBVB900I |
| PNEDA Part # | XCZU7EV-1FBVB900I |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 4,500 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 1 - Apr 6 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
|
Free shipping on orders over $100. PNEDA is willing to provide you with better services.
|
|
|
|
|
XCZU7EV-1FBVB900I Resources
| Brand | Xilinx |
| ECAD Module |
|
| Mfr. Part Number | XCZU7EV-1FBVB900I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
- Registered users can log in to the account to view the order status.
- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.
Our approach is built around proving our clients with three key advantages:
Prompt Responsiveness
Our team responds quickly to your requests, and gets to work immediately to find your parts.
Guaranteed Quality
Our quality-control processes guard against counterfeits while ensuring reliability and performance.
Global Access
Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.
Hot search vocabulary
- XCZU7EV-1FBVB900I Datasheet
- where to find XCZU7EV-1FBVB900I
- Xilinx
- Xilinx XCZU7EV-1FBVB900I
- XCZU7EV-1FBVB900I PDF Datasheet
- XCZU7EV-1FBVB900I Stock
- XCZU7EV-1FBVB900I Pinout
- Datasheet XCZU7EV-1FBVB900I
- XCZU7EV-1FBVB900I Supplier
- Xilinx Distributor
- XCZU7EV-1FBVB900I Price
- XCZU7EV-1FBVB900I Distributor
XCZU7EV-1FBVB900I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
The Products You May Be Interested In
|
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 660K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FBGA, FC (40x40) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DMA, POR, WDT Connectivity Ethernet, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Intel Series Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 800MHz Primary Attributes FPGA - 85K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 667MHz Primary Attributes Artix™-7 FPGA, 65K Logic Cells Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-LFBGA, CSPBGA Supplier Device Package 484-CSPBGA (19x19) |
Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 667MHz Primary Attributes Kintex™-7 FPGA, 350K Logic Cells Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |
