XCZU5EG-3SFVC784E
For Reference Only
| Part Number | XCZU5EG-3SFVC784E |
| PNEDA Part # | XCZU5EG-3SFVC784E |
| Description | IC SOC CORTEX-A53 784FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 4,158 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XCZU5EG-3SFVC784E Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XCZU5EG-3SFVC784E |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XCZU5EG-3SFVC784E Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 784-BFBGA, FCBGA |
| Supplier Device Package | 784-FCBGA (23x23) |
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Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 600MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 85K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 90K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 325-TFBGA, CSPBGA Supplier Device Package 325-CSPBGA (11x11) |
