Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU4EV-3FBVB900E

XCZU4EV-3FBVB900E

For Reference Only

Part Number XCZU4EV-3FBVB900E
PNEDA Part # XCZU4EV-3FBVB900E
Description IC SOC CORTEX-A53 900FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 5,490
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 24 - Nov 29 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU4EV-3FBVB900E Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU4EV-3FBVB900E
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU4EV-3FBVB900E, XCZU4EV-3FBVB900E Datasheet (Total Pages: 42, Size: 1,058.56 KB)
PDFXCZU3EG-3SFVC784E Datasheet Cover
XCZU3EG-3SFVC784E Datasheet Page 2 XCZU3EG-3SFVC784E Datasheet Page 3 XCZU3EG-3SFVC784E Datasheet Page 4 XCZU3EG-3SFVC784E Datasheet Page 5 XCZU3EG-3SFVC784E Datasheet Page 6 XCZU3EG-3SFVC784E Datasheet Page 7 XCZU3EG-3SFVC784E Datasheet Page 8 XCZU3EG-3SFVC784E Datasheet Page 9 XCZU3EG-3SFVC784E Datasheet Page 10 XCZU3EG-3SFVC784E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU4EV-3FBVB900E Datasheet
  • where to find XCZU4EV-3FBVB900E
  • Xilinx

  • Xilinx XCZU4EV-3FBVB900E
  • XCZU4EV-3FBVB900E PDF Datasheet
  • XCZU4EV-3FBVB900E Stock

  • XCZU4EV-3FBVB900E Pinout
  • Datasheet XCZU4EV-3FBVB900E
  • XCZU4EV-3FBVB900E Supplier

  • Xilinx Distributor
  • XCZU4EV-3FBVB900E Price
  • XCZU4EV-3FBVB900E Distributor

XCZU4EV-3FBVB900E Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EV
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed600MHz, 1.5GHz
Primary AttributesZynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

The Products You May Be Interested In

Manufacturer

Intel

Series

Arria V SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

FPGA - 462K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FBGA, FC (40x40)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1760-BBGA, FCBGA

Supplier Device Package

1760-FCBGA (42.5x42.5)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1156-BBGA, FCBGA

Supplier Device Package

1156-FCBGA (35x35)

M2S060T-1FG484

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 60K Logic Modules

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

Recently Sold

MAX14757EUE+

MAX14757EUE+

Maxim Integrated

IC SWITCH QUAD SPST 16TSSOP

AT25M01-SSHM-T

AT25M01-SSHM-T

Microchip Technology

IC EEPROM 1M SPI 20MHZ 8SOIC

NE3509M04-A

NE3509M04-A

CEL

FET RF 4V 2GHZ 4-SMINI

TAJB475K016RNJ

TAJB475K016RNJ

CAP TANT 4.7UF 10% 16V 1411

NVMFS5A160PLZT1G

NVMFS5A160PLZT1G

ON Semiconductor

-60V7.7MOHMSINGLE

WSL20108L000FEA

WSL20108L000FEA

Vishay Dale

RES 0.008 OHM 1% 1/2W 2010

NOIP2SE1300A-QDI

NOIP2SE1300A-QDI

ON Semiconductor

IC IMAGE SENSOR 1.3MP 48LCC

ESD3V3D5B-TP

ESD3V3D5B-TP

Micro Commercial Co

TVS DIODE 3.3V 12V SOD523

MC68HC908GP32CFB

MC68HC908GP32CFB

NXP

IC MCU 8BIT 32KB FLASH 44QFP

10MQ060NTR

10MQ060NTR

Vishay Semiconductor Diodes Division

DIODE SCHOTTKY 60V 2.1A SMA

MBR140SFT1G

MBR140SFT1G

ON Semiconductor

DIODE SCHOTTKY 40V 1A SOD123L

P6KE150A

P6KE150A

Taiwan Semiconductor Corporation

TVS DIODE 128V 207V DO15