XCZU4EV-1FBVB900I
For Reference Only
| Part Number | XCZU4EV-1FBVB900I |
| PNEDA Part # | XCZU4EV-1FBVB900I |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 2,394 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 19 - Mar 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XCZU4EV-1FBVB900I Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XCZU4EV-1FBVB900I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XCZU4EV-1FBVB900I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
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Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -55°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
