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XC7Z035-2FFG900E

XC7Z035-2FFG900E

For Reference Only

Part Number XC7Z035-2FFG900E
PNEDA Part # XC7Z035-2FFG900E
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 5,958
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 23 - Nov 28 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC7Z035-2FFG900E Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC7Z035-2FFG900E
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XC7Z035-2FFG900E, XC7Z035-2FFG900E Datasheet (Total Pages: 25, Size: 716.41 KB)
PDFXC7Z045-2FBG676CES Datasheet Cover
XC7Z045-2FBG676CES Datasheet Page 2 XC7Z045-2FBG676CES Datasheet Page 3 XC7Z045-2FBG676CES Datasheet Page 4 XC7Z045-2FBG676CES Datasheet Page 5 XC7Z045-2FBG676CES Datasheet Page 6 XC7Z045-2FBG676CES Datasheet Page 7 XC7Z045-2FBG676CES Datasheet Page 8 XC7Z045-2FBG676CES Datasheet Page 9 XC7Z045-2FBG676CES Datasheet Page 10 XC7Z045-2FBG676CES Datasheet Page 11

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XC7Z035-2FFG900E Specifications

ManufacturerXilinx Inc.
SeriesZynq®-7000
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

The Products You May Be Interested In

Manufacturer

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Series

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Architecture

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Core Processor

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Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

Kintex™-7 FPGA, 125K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

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Microsemi

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512KB

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Speed

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Primary Attributes

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Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

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Flash Size

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Peripherals

DMA, POR, WDT

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EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

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Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

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Manufacturer

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Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

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Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

A2F200M3F-1CS288I

Microsemi

Manufacturer

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Architecture

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Flash Size

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RAM Size

64KB

Peripherals

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Connectivity

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Speed

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Primary Attributes

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

288-TFBGA, CSPBGA

Supplier Device Package

288-CSP (11x11)

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