XC7Z030-2FBG484E
For Reference Only
| Part Number | XC7Z030-2FBG484E |
| PNEDA Part # | XC7Z030-2FBG484E |
| Description | IC SOC CORTEX-A9 800MHZ 484FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 11 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 18 - Mar 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XC7Z030-2FBG484E Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XC7Z030-2FBG484E |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XC7Z030-2FBG484E Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq®-7000 |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FCBGA (23x23) |
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Manufacturer Intel Series Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 925MHz Primary Attributes FPGA - 25K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 600MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FCBGA (40x40) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
