XC7Z030-1FFG676C
For Reference Only
| Part Number | XC7Z030-1FFG676C |
| PNEDA Part # | XC7Z030-1FFG676C |
| Description | IC SOC CORTEX-A9 667MHZ 676FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 3,762 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 3 - Apr 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
|
Free shipping on orders over $100. PNEDA is willing to provide you with better services.
|
|
|
|
|
XC7Z030-1FFG676C Resources
| Brand | Xilinx |
| ECAD Module |
|
| Mfr. Part Number | XC7Z030-1FFG676C |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
- Registered users can log in to the account to view the order status.
- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.
Our approach is built around proving our clients with three key advantages:
Prompt Responsiveness
Our team responds quickly to your requests, and gets to work immediately to find your parts.
Guaranteed Quality
Our quality-control processes guard against counterfeits while ensuring reliability and performance.
Global Access
Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.
Hot search vocabulary
- XC7Z030-1FFG676C Datasheet
- where to find XC7Z030-1FFG676C
- Xilinx
- Xilinx XC7Z030-1FFG676C
- XC7Z030-1FFG676C PDF Datasheet
- XC7Z030-1FFG676C Stock
- XC7Z030-1FFG676C Pinout
- Datasheet XC7Z030-1FFG676C
- XC7Z030-1FFG676C Supplier
- Xilinx Distributor
- XC7Z030-1FFG676C Price
- XC7Z030-1FFG676C Distributor
XC7Z030-1FFG676C Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq®-7000 |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
The Products You May Be Interested In
|
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 100K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FCBGA (35x35) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 90K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC CG Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq®-7000 Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 800MHz Primary Attributes Kintex™-7 FPGA, 125K Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 25K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 400-LFBGA Supplier Device Package 400-VFBGA (17x17) |
