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XC6SLX75-N3FG676C

XC6SLX75-N3FG676C

For Reference Only

Part Number XC6SLX75-N3FG676C
PNEDA Part # XC6SLX75-N3FG676C
Description IC FPGA 408 I/O 676FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 3,636
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Mar 19 - Mar 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC6SLX75-N3FG676C Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC6SLX75-N3FG676C
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)
Datasheet
XC6SLX75-N3FG676C, XC6SLX75-N3FG676C Datasheet (Total Pages: 89, Size: 3,276.17 KB)
PDFXC6SLX9-N3FT256I Datasheet Cover
XC6SLX9-N3FT256I Datasheet Page 2 XC6SLX9-N3FT256I Datasheet Page 3 XC6SLX9-N3FT256I Datasheet Page 4 XC6SLX9-N3FT256I Datasheet Page 5 XC6SLX9-N3FT256I Datasheet Page 6 XC6SLX9-N3FT256I Datasheet Page 7 XC6SLX9-N3FT256I Datasheet Page 8 XC6SLX9-N3FT256I Datasheet Page 9 XC6SLX9-N3FT256I Datasheet Page 10 XC6SLX9-N3FT256I Datasheet Page 11

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XC6SLX75-N3FG676C Specifications

ManufacturerXilinx Inc.
SeriesSpartan®-6 LX
Number of LABs/CLBs5831
Number of Logic Elements/Cells74637
Total RAM Bits3170304
Number of I/O408
Number of Gates-
Voltage - Supply1.14V ~ 1.26V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)

The Products You May Be Interested In

Manufacturer

Intel

Series

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Number of LABs/CLBs

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Number of Logic Elements/Cells

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Total RAM Bits

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Number of I/O

364

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

780-BBGA

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Series

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Number of LABs/CLBs

21248

Number of Logic Elements/Cells

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Total RAM Bits

28033024

Number of I/O

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Number of Gates

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Voltage - Supply

0.87V ~ 0.93V

Mounting Type

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Operating Temperature

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Package / Case

1760-BBGA, FCBGA

Supplier Device Package

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LAXP2-8E-5FTN256E

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

LA-XP2

Number of LABs/CLBs

1000

Number of Logic Elements/Cells

8000

Total RAM Bits

226304

Number of I/O

201

Number of Gates

-

Voltage - Supply

1.14V ~ 1.26V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FTBGA (17x17)

LFXP2-5E-6MN132I

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

XP2

Number of LABs/CLBs

625

Number of Logic Elements/Cells

5000

Total RAM Bits

169984

Number of I/O

86

Number of Gates

-

Voltage - Supply

1.14V ~ 1.26V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

132-LFBGA, CSPBGA

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LCMXO2-256HC-6SG32I

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

MachXO2

Number of LABs/CLBs

32

Number of Logic Elements/Cells

256

Total RAM Bits

-

Number of I/O

21

Number of Gates

-

Voltage - Supply

2.375V ~ 3.465V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

32-UFQFN Exposed Pad

Supplier Device Package

32-QFNS (5x5)

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