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XC6SLX25-2CSG324C

XC6SLX25-2CSG324C

For Reference Only

Part Number XC6SLX25-2CSG324C
PNEDA Part # XC6SLX25-2CSG324C
Description IC FPGA 226 I/O 324CSBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 9,220
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Feb 19 - Feb 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC6SLX25-2CSG324C Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC6SLX25-2CSG324C
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)
Datasheet
XC6SLX25-2CSG324C, XC6SLX25-2CSG324C Datasheet (Total Pages: 89, Size: 3,276.17 KB)
PDFXC6SLX9-N3FT256I Datasheet Cover
XC6SLX9-N3FT256I Datasheet Page 2 XC6SLX9-N3FT256I Datasheet Page 3 XC6SLX9-N3FT256I Datasheet Page 4 XC6SLX9-N3FT256I Datasheet Page 5 XC6SLX9-N3FT256I Datasheet Page 6 XC6SLX9-N3FT256I Datasheet Page 7 XC6SLX9-N3FT256I Datasheet Page 8 XC6SLX9-N3FT256I Datasheet Page 9 XC6SLX9-N3FT256I Datasheet Page 10 XC6SLX9-N3FT256I Datasheet Page 11

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XC6SLX25-2CSG324C Specifications

ManufacturerXilinx Inc.
SeriesSpartan®-6 LX
Number of LABs/CLBs1879
Number of Logic Elements/Cells24051
Total RAM Bits958464
Number of I/O226
Number of Gates-
Voltage - Supply1.14V ~ 1.26V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case324-LFBGA, CSPBGA
Supplier Device Package324-CSPBGA (15x15)

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Manufacturer

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Series

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Number of LABs/CLBs

3456

Number of Logic Elements/Cells

15552

Total RAM Bits

98304

Number of I/O

404

Number of Gates

661111

Voltage - Supply

2.375V ~ 2.625V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

560-LBGA Exposed Pad, Metal

Supplier Device Package

560-MBGA (42.5x42.5)

Manufacturer

Xilinx Inc.

Series

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Number of LABs/CLBs

1176

Number of Logic Elements/Cells

5292

Total RAM Bits

57344

Number of I/O

260

Number of Gates

236666

Voltage - Supply

2.375V ~ 2.625V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

352-LBGA Exposed Pad, Metal

Supplier Device Package

352-MBGA (35x35)

Manufacturer

Xilinx Inc.

Series

Virtex® UltraScale™

Number of LABs/CLBs

89520

Number of Logic Elements/Cells

1566600

Total RAM Bits

90726400

Number of I/O

702

Number of Gates

-

Voltage - Supply

0.922V ~ 1.030V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

2104-BBGA, FCBGA

Supplier Device Package

2104-FCBGA (47.5x47.5)

A3P1000-2FG256M

Microsemi

Manufacturer

Microsemi Corporation

Series

ProASIC3

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

147456

Number of I/O

177

Number of Gates

1000000

Voltage - Supply

1.14V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

-55°C ~ 125°C (TJ)

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Manufacturer

Intel

Series

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Number of LABs/CLBs

11460

Number of Logic Elements/Cells

242000

Total RAM Bits

15470592

Number of I/O

384

Number of Gates

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Voltage - Supply

1.07V ~ 1.13V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

896-BBGA, FCBGA

Supplier Device Package

896-FBGA (31x31)

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