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XAZU3EG-1SFVA625Q

XAZU3EG-1SFVA625Q

For Reference Only

Part Number XAZU3EG-1SFVA625Q
PNEDA Part # XAZU3EG-1SFVA625Q
Description IC SOC CORTEX-A53 625FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 3,472
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Mar 23 - Mar 28 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XAZU3EG-1SFVA625Q Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXAZU3EG-1SFVA625Q
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XAZU3EG-1SFVA625Q, XAZU3EG-1SFVA625Q Datasheet (Total Pages: 36, Size: 999.21 KB)
PDFXAZU3EG-1SFVC784Q Datasheet Cover
XAZU3EG-1SFVC784Q Datasheet Page 2 XAZU3EG-1SFVC784Q Datasheet Page 3 XAZU3EG-1SFVC784Q Datasheet Page 4 XAZU3EG-1SFVC784Q Datasheet Page 5 XAZU3EG-1SFVC784Q Datasheet Page 6 XAZU3EG-1SFVC784Q Datasheet Page 7 XAZU3EG-1SFVC784Q Datasheet Page 8 XAZU3EG-1SFVC784Q Datasheet Page 9 XAZU3EG-1SFVC784Q Datasheet Page 10 XAZU3EG-1SFVC784Q Datasheet Page 11

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XAZU3EG-1SFVA625Q Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMPU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size1.8MB
PeripheralsDMA, WDT
ConnectivityCANbus, I²C, SPI, UART/USART, USB
Speed500MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature-40°C ~ 125°C (TJ)
Package / Case625-BFBGA, FCBGA
Supplier Device Package625-FCBGA (21x21)

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Architecture

MCU, FPGA

Core Processor

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Flash Size

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RAM Size

256KB

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Primary Attributes

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0°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA, FC (35x35)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MPU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

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RAM Size

1.8MB

Peripherals

DMA, WDT

Connectivity

CANbus, I²C, SPI, UART/USART, USB

Speed

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Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

784-BFBGA, FCBGA

Supplier Device Package

784-FCBGA (23x23)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

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RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

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RAM Size

256KB

Peripherals

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Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

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Primary Attributes

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Operating Temperature

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Package / Case

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Supplier Device Package

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