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W25Q256JVCIM

W25Q256JVCIM

For Reference Only

Part Number W25Q256JVCIM
PNEDA Part # W25Q256JVCIM
Description IC FLASH 256M SPI 24TFBGA
Manufacturer Winbond Electronics
Unit Price Request a Quote
In Stock 7,146
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 9 - Nov 14 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

W25Q256JVCIM Resources

Brand Winbond Electronics
ECAD Module ECAD
Mfr. Part NumberW25Q256JVCIM
CategorySemiconductorsMemory ICsMemory
Datasheet
W25Q256JVCIM, W25Q256JVCIM Datasheet (Total Pages: 92, Size: 1,663.18 KB)
PDFW25Q256JVEIM Datasheet Cover
W25Q256JVEIM Datasheet Page 2 W25Q256JVEIM Datasheet Page 3 W25Q256JVEIM Datasheet Page 4 W25Q256JVEIM Datasheet Page 5 W25Q256JVEIM Datasheet Page 6 W25Q256JVEIM Datasheet Page 7 W25Q256JVEIM Datasheet Page 8 W25Q256JVEIM Datasheet Page 9 W25Q256JVEIM Datasheet Page 10 W25Q256JVEIM Datasheet Page 11

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W25Q256JVCIM Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size256Mb (32M x 8)
Memory InterfaceSPI - Quad I/O
Clock Frequency133MHz
Write Cycle Time - Word, Page3ms
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)

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