TMX5703137BPGEQQ1
For Reference Only
| Part Number | TMX5703137BPGEQQ1 |
| PNEDA Part # | TMX5703137BPGEQQ1 |
| Description | IC MCU 32BIT 3MB FLASH 144LQFP |
| Manufacturer | Texas Instruments |
| Unit Price | Request a Quote |
| In Stock | 5,310 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 18 - Mar 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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TMX5703137BPGEQQ1 Resources
| Brand | Texas Instruments |
| ECAD Module |
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| Mfr. Part Number | TMX5703137BPGEQQ1 |
| Category | Semiconductors › Embedded Processors & Controllers › Microcontrollers |
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- Delivery date: usually 2 to 7 working days.
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Notes
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TMX5703137BPGEQQ1 Specifications
| Manufacturer | |
| Series | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R |
| Core Processor | ARM® Cortex®-R4F |
| Core Size | 16/32-Bit |
| Speed | 160MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 58 |
| Program Memory Size | 3MB (3M x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 64K x 8 |
| RAM Size | 256K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.14V ~ 3.6V |
| Data Converters | A/D 24x12b |
| Oscillator Type | External |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Supplier Device Package | 144-LQFP (20x20) |
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Manufacturer Series Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R Core Processor ARM® Cortex®-R4F Core Size 16/32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals DMA, POR, PWM, WDT Number of I/O 120 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size 64K x 8 RAM Size 256K x 8 Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V Data Converters A/D 24x12b Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 337-LFBGA Supplier Device Package 337-NFBGA (16x16) |
Manufacturer Series MSP430G2xx Core Processor MSP430 Core Size 16-Bit Speed 16MHz Connectivity I²C, SPI, USI Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O 16 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |
Manufacturer Cypress Semiconductor Corp Series F²MC-16LX MB90385 Core Processor F²MC-16LX Core Size 16-Bit Speed 16MHz Connectivity CANbus, SCI, UART/USART Peripherals POR, WDT Number of I/O 36 Program Memory Size 64KB (64K x 8) Program Memory Type Mask ROM EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 3.5V ~ 5.5V Data Converters A/D 8x8/10b Oscillator Type External Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 48-LQFP Supplier Device Package 48-LQFP (7x7) |
