MCP6022T-E/STVAO
For Reference Only
| Part Number | MCP6022T-E/STVAO |
| PNEDA Part # | MCP6022T-E-STVAO |
| Description | IC OPAMP GP 2 CIRCUIT 8TSSOP |
| Manufacturer | Microchip Technology |
| Unit Price | Request a Quote |
| In Stock | 2,484 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 20 - Mar 25 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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MCP6022T-E/STVAO Resources
| Brand | Microchip Technology |
| ECAD Module |
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| Mfr. Part Number | MCP6022T-E/STVAO |
| Category | Semiconductors › Amplifier ICs › Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
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MCP6022T-E/STVAO Specifications
| Manufacturer | Microchip Technology |
| Series | Automotive, AEC-Q100 |
| Amplifier Type | General Purpose |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 7V/µs |
| Gain Bandwidth Product | 10MHz |
| -3db Bandwidth | - |
| Current - Input Bias | 1pA |
| Voltage - Input Offset | 500µV |
| Current - Supply | 1mA |
| Current - Output / Channel | 30mA |
| Voltage - Supply, Single/Dual (±) | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package / Case | 8-TSSOP (0.173", 4.40mm Width) |
| Supplier Device Package | 8-TSSOP |
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Manufacturer Series MicroAmplifier™ Amplifier Type General Purpose Number of Circuits 2 Output Type Rail-to-Rail Slew Rate 0.03V/µs Gain Bandwidth Product 100kHz -3db Bandwidth - Current - Input Bias 1pA Voltage - Input Offset 60µV Current - Supply 20µA Current - Output / Channel 5mA Voltage - Supply, Single/Dual (±) 2.3V ~ 5.5V Operating Temperature -40°C ~ 85°C Mounting Type Through Hole Package / Case 8-DIP (0.300", 7.62mm) Supplier Device Package 8-PDIP |
Manufacturer Series MicroAmplifier™ Amplifier Type General Purpose Number of Circuits - Output Type Rail-to-Rail Slew Rate - Gain Bandwidth Product - -3db Bandwidth - Current - Input Bias - Voltage - Input Offset - Current - Supply - Current - Output / Channel - Voltage - Supply, Single/Dual (±) 2.5V Operating Temperature - Mounting Type - Package / Case Die Supplier Device Package Die |
