MCP23S18T-E/MJVAO
For Reference Only
Part Number | MCP23S18T-E/MJVAO |
PNEDA Part # | MCP23S18T-E-MJVAO |
Description | EXPANDERS |
Manufacturer | Microchip Technology |
Unit Price | Request a Quote |
In Stock | 8,496 |
Warehouses | Shipped from Hong Kong SAR |
Estimated Delivery | Nov 30 - Dec 5 (Choose Expedited Shipping) |
Guarantee | Up to 1 year [PNEDA-Warranty]* |
Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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MCP23S18T-E/MJVAO Resources
Brand | Microchip Technology |
ECAD Module | |
Mfr. Part Number | MCP23S18T-E/MJVAO |
Category | Semiconductors › Interface ICs › Interface - I/O Expanders |
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MCP23S18T-E/MJVAO Specifications
Manufacturer | Microchip Technology |
Series | Automotive, AEC-Q100 |
Number of I/O | 16 |
Interface | SPI |
Interrupt Output | Yes |
Features | POR |
Output Type | Open Drain |
Current - Output Source/Sink | 25mA |
Clock Frequency | 10MHz |
Voltage - Supply | 1.8V ~ 5.5V |
Operating Temperature | -40°C ~ 125°C |
Mounting Type | Surface Mount |
Package / Case | 24-VFQFN Exposed Pad |
Supplier Device Package | 24-QFN (4x4) |
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NXP Manufacturer NXP USA Inc. Series - Number of I/O 8 Interface I²C, SMBus Interrupt Output Yes Features POR Output Type Push-Pull Current - Output Source/Sink 10mA, 25mA Clock Frequency 400kHz Voltage - Supply 1.65V ~ 5.5V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 16-VFQFN Exposed Pad Supplier Device Package 16-HVQFN (3x3) |