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MC68EN360ZP25VL

MC68EN360ZP25VL

For Reference Only

Part Number MC68EN360ZP25VL
PNEDA Part # MC68EN360ZP25VL
Description IC MPU M683XX 25MHZ 357BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 6,948
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Mar 31 - Apr 5 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MC68EN360ZP25VL Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMC68EN360ZP25VL
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
MC68EN360ZP25VL, MC68EN360ZP25VL Datasheet (Total Pages: 962, Size: 7,011.33 KB)
PDFMC68360ZQ25L Datasheet Cover
MC68360ZQ25L Datasheet Page 2 MC68360ZQ25L Datasheet Page 3 MC68360ZQ25L Datasheet Page 4 MC68360ZQ25L Datasheet Page 5 MC68360ZQ25L Datasheet Page 6 MC68360ZQ25L Datasheet Page 7 MC68360ZQ25L Datasheet Page 8 MC68360ZQ25L Datasheet Page 9 MC68360ZQ25L Datasheet Page 10 MC68360ZQ25L Datasheet Page 11

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MC68EN360ZP25VL Specifications

ManufacturerNXP USA Inc.
SeriesM683xx
Core ProcessorCPU32+
Number of Cores/Bus Width1 Core, 32-Bit
Speed25MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature0°C ~ 70°C (TA)
Security Features-
Package / Case357-BGA
Supplier Device Package357-PBGA (25x25)

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Series

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Number of Cores/Bus Width

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Speed

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Co-Processors/DSP

-

RAM Controllers

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Graphics Acceleration

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Display & Interface Controllers

-

Ethernet

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SATA

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USB

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Voltage - I/O

5.0V

Operating Temperature

0°C ~ 70°C (TA)

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Manufacturer

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Series

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Core Processor

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Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

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Graphics Acceleration

Yes

Display & Interface Controllers

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Ethernet

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SATA

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Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

624-LFBGA

Supplier Device Package

624-MAPBGA (21x21)

Manufacturer

NXP USA Inc.

Series

i.MX6D

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000Mbps (1)

SATA

SATA 3Gbps (1)

USB

USB 2.0 + PHY (4)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

624-FBGA, FCBGA

Supplier Device Package

624-FCBGA (21x21)

Manufacturer

NXP USA Inc.

Series

QorIQ® Layerscape

Core Processor

ARM® Cortex®-A53

Number of Cores/Bus Width

1 Core, 64-Bit

Speed

800MHz

Co-Processors/DSP

-

RAM Controllers

DDR3L

Graphics Acceleration

-

Display & Interface Controllers

-

Ethernet

GbE (2)

SATA

SATA 6Gbps (1)

USB

USB 2.0 (1), USB 3.0 + PHY

Voltage - I/O

-

Operating Temperature

0°C ~ 105°C

Security Features

Secure Boot, TrustZone®

Package / Case

211-VFLGA

Supplier Device Package

211-FCLGA (9.6x9.6)

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

400MHz

Co-Processors/DSP

-

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

USB 2.0 + PHY (2)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 105°C (TA)

Security Features

-

Package / Case

672-LBGA

Supplier Device Package

672-TBGA (35x35)

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