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MC56F8167VPYE

MC56F8167VPYE

For Reference Only

Part Number MC56F8167VPYE
PNEDA Part # MC56F8167VPYE
Description IC MCU 16BIT 512KB FLASH 160LQFP
Manufacturer NXP
Unit Price
1 ---------- $385.8221
50 ---------- $367.7367
100 ---------- $349.6513
200 ---------- $331.5659
400 ---------- $316.4947
500 ---------- $301.4235
In Stock 281
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 26 - Dec 1 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MC56F8167VPYE Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMC56F8167VPYE
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers
Datasheet
MC56F8167VPYE, MC56F8167VPYE Datasheet (Total Pages: 182, Size: 1,626.92 KB)
PDFMC56F8367VVFE Datasheet Cover
MC56F8367VVFE Datasheet Page 2 MC56F8367VVFE Datasheet Page 3 MC56F8367VVFE Datasheet Page 4 MC56F8367VVFE Datasheet Page 5 MC56F8367VVFE Datasheet Page 6 MC56F8367VVFE Datasheet Page 7 MC56F8367VVFE Datasheet Page 8 MC56F8367VVFE Datasheet Page 9 MC56F8367VVFE Datasheet Page 10 MC56F8367VVFE Datasheet Page 11

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MC56F8167VPYE Specifications

ManufacturerNXP USA Inc.
Series56F8xxx
Core Processor56800E
Core Size16-Bit
Speed40MHz
ConnectivityEBI/EMI, SCI, SPI
PeripheralsPOR, PWM, WDT
Number of I/O76
Program Memory Size512KB (256K x 16)
Program Memory TypeFLASH
EEPROM Size-
RAM Size16K x 16
Voltage - Supply (Vcc/Vdd)2.25V ~ 3.6V
Data ConvertersA/D 16x12b
Oscillator TypeExternal
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case160-LQFP
Supplier Device Package160-LQFP (24x24)

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Oscillator Type

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Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

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Package / Case

160-BGA

Supplier Device Package

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Manufacturer

NXP USA Inc.

Series

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Core Processor

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Core Size

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Speed

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Connectivity

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Supplier Device Package

64-QFP (14x14)

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NXP USA Inc.

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LVD, POR, PWM

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Program Memory Size

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Program Memory Type

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EEPROM Size

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RAM Size

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Voltage - Supply (Vcc/Vdd)

4V ~ 5.5V

Data Converters

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0°C ~ 70°C (TA)

Mounting Type

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20-SOIC (0.295", 7.50mm Width)

Supplier Device Package

20-SOIC

Manufacturer

NXP USA Inc.

Series

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Core Processor

S08

Core Size

8-Bit

Speed

40MHz

Connectivity

CANbus, I²C, LINbus, SCI, SPI

Peripherals

LVD, POR, PWM, WDT

Number of I/O

53

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

2.7V ~ 5.5V

Data Converters

A/D 24x12b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

64-LQFP

Supplier Device Package

64-LQFP (10x10)

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