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MC33PF8200D2ES

MC33PF8200D2ES

For Reference Only

Part Number MC33PF8200D2ES
PNEDA Part # MC33PF8200D2ES
Description IC POWER MANAGEMENT
Manufacturer NXP
Unit Price Request a Quote
In Stock 6,156
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 26 - Dec 1 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MC33PF8200D2ES Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMC33PF8200D2ES
CategorySemiconductorsPower Management ICsPMIC - Power Management - Specialized
Datasheet
MC33PF8200D2ES, MC33PF8200D2ES Datasheet (Total Pages: 131, Size: 1,158.18 KB)
PDFMC33PF8200ETES Datasheet Cover
MC33PF8200ETES Datasheet Page 2 MC33PF8200ETES Datasheet Page 3 MC33PF8200ETES Datasheet Page 4 MC33PF8200ETES Datasheet Page 5 MC33PF8200ETES Datasheet Page 6 MC33PF8200ETES Datasheet Page 7 MC33PF8200ETES Datasheet Page 8 MC33PF8200ETES Datasheet Page 9 MC33PF8200ETES Datasheet Page 10 MC33PF8200ETES Datasheet Page 11

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MC33PF8200D2ES Specifications

ManufacturerNXP USA Inc.
Series-
ApplicationsHigh Performance i.MX 8, S32x Processor Based
Current - Supply-
Voltage - Supply2.5V ~ 5.5V
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount, Wettable Flank
Package / Case56-VFQFN Exposed Pad
Supplier Device Package56-HVQFN (8x8)

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