M58LT256KSB8ZA6E
For Reference Only
| Part Number | M58LT256KSB8ZA6E |
| PNEDA Part # | M58LT256KSB8ZA6E |
| Description | IC FLASH 256M PARALLEL 64TBGA |
| Manufacturer | Micron Technology Inc. |
| Unit Price | Request a Quote |
| In Stock | 6,336 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 30 - Apr 4 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M58LT256KSB8ZA6E Resources
| Brand | Micron Technology Inc. |
| ECAD Module |
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| Mfr. Part Number | M58LT256KSB8ZA6E |
| Category | Semiconductors › Memory ICs › Memory |
| Datasheet |
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Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
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Notes
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M58LT256KSB8ZA6E Specifications
| Manufacturer | Micron Technology Inc. |
| Series | - |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mb (16M x 16) |
| Memory Interface | Parallel |
| Clock Frequency | 52MHz |
| Write Cycle Time - Word, Page | 85ns |
| Access Time | 85ns |
| Voltage - Supply | 1.7V ~ 2V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 64-TBGA |
| Supplier Device Package | 64-TBGA (10x13) |
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Manufacturer Micron Technology Inc. Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - DDR2 Memory Size 512Mb (64M x 8) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time 400ps Voltage - Supply 1.7V ~ 1.9V Operating Temperature -40°C ~ 95°C (TC) Mounting Type Surface Mount Package / Case 60-TFBGA Supplier Device Package 60-FBGA (8x10) |
Manufacturer Cypress Semiconductor Corp Series AS-J Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 8Mb (1M x 8, 512K x 16) Memory Interface Parallel Clock Frequency - Write Cycle Time - Word, Page 70ns Access Time 70ns Voltage - Supply 1.65V ~ 1.95V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case Die Supplier Device Package Wafer |
