M2S150T-1FCG1152M
For Reference Only
| Part Number | M2S150T-1FCG1152M |
| PNEDA Part # | M2S150T-1FCG1152M |
| Description | IC SOC CORTEX-M3 166MHZ 1152BGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 7,866 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 21 - Mar 26 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M2S150T-1FCG1152M Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M2S150T-1FCG1152M |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
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Logistics Mode
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- Delivery date: usually 2 to 7 working days.
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M2S150T-1FCG1152M Specifications
| Manufacturer | Microsemi Corporation |
| Series | SmartFusion®2 |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 150K Logic Modules |
| Operating Temperature | -55°C ~ 125°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FCBGA (35x35) |
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Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 600MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 50K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
