M2S060TS-1FG484
For Reference Only
| Part Number | M2S060TS-1FG484 |
| PNEDA Part # | M2S060TS-1FG484 |
| Description | IC SOC CORTEX-M3 166MHZ 484FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 4,410 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Feb 19 - Feb 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M2S060TS-1FG484 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M2S060TS-1FG484 |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Payment Method
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- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
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- Orders cannot be canceled after shipping the packages.
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M2S060TS-1FG484 Specifications
| Manufacturer | Microsemi Corporation |
| Series | SmartFusion®2 |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 60K Logic Modules |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
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Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 60K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature -40°C ~ 100°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
