M2GL060-1FGG676
For Reference Only
| Part Number | M2GL060-1FGG676 |
| PNEDA Part # | M2GL060-1FGG676 |
| Description | IC FPGA 387 I/O 676FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 2,430 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 25 - Nov 30 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M2GL060-1FGG676 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M2GL060-1FGG676 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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Logistics Mode
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M2GL060-1FGG676 Specifications
| Manufacturer | Microsemi Corporation |
| Series | IGLOO2 |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | 56520 |
| Total RAM Bits | 1869824 |
| Number of I/O | 387 |
| Number of Gates | - |
| Voltage - Supply | 1.14V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
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Manufacturer Microsemi Corporation Series ProASIC3L Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 516096 Number of I/O 620 Number of Gates 3000000 Voltage - Supply 1.14V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
