M29DW323DB70ZE6E
For Reference Only
| Part Number | M29DW323DB70ZE6E |
| PNEDA Part # | M29DW323DB70ZE6E |
| Description | IC FLASH 32M PARALLEL 48TFBGA |
| Manufacturer | Micron Technology Inc. |
| Unit Price | Request a Quote |
| In Stock | 11,290 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 20 - Apr 25 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M29DW323DB70ZE6E Resources
| Brand | Micron Technology Inc. |
| ECAD Module |
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| Mfr. Part Number | M29DW323DB70ZE6E |
| Category | Semiconductors › Memory ICs › Memory |
| Datasheet |
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Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
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Notes
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M29DW323DB70ZE6E Specifications
| Manufacturer | Micron Technology Inc. |
| Series | - |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 32Mb (4M x 8, 2M x 16) |
| Memory Interface | Parallel |
| Clock Frequency | - |
| Write Cycle Time - Word, Page | 70ns |
| Access Time | 70ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFBGA |
| Supplier Device Package | 48-TFBGA (6x8) |
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Manufacturer Micron Technology Inc. Series - Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND Memory Size 1Gb (128M x 8) Memory Interface Parallel Clock Frequency - Write Cycle Time - Word, Page - Access Time - Voltage - Supply 2.7V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 63-VFBGA Supplier Device Package 63-VFBGA (9x11) |
Manufacturer Maxim Integrated Series - Memory Type Non-Volatile Memory Format NVSRAM Technology NVSRAM (Non-Volatile SRAM) Memory Size 8Mb (1M x 8) Memory Interface Parallel Clock Frequency - Write Cycle Time - Word, Page 100ns Access Time 100ns Voltage - Supply 4.75V ~ 5.25V Operating Temperature 0°C ~ 70°C (TA) Mounting Type Through Hole Package / Case 36-DIP Module (0.600", 15.24mm) Supplier Device Package 36-EDIP |
