M1AFS600-1FGG484
For Reference Only
| Part Number | M1AFS600-1FGG484 |
| PNEDA Part # | M1AFS600-1FGG484 |
| Description | IC FPGA 172 I/O 484FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 4,932 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1AFS600-1FGG484 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1AFS600-1FGG484 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1AFS600-1FGG484 Specifications
| Manufacturer | Microsemi Corporation |
| Series | Fusion® |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 110592 |
| Number of I/O | 172 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
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Manufacturer Microsemi Corporation Series ProASIC3E Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 444 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 3125 Number of Logic Elements/Cells 50000 Total RAM Bits 1677312 Number of I/O 360 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FBGA (23x23) |
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