Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

M1A3P600-2FG484I

M1A3P600-2FG484I

For Reference Only

Part Number M1A3P600-2FG484I
PNEDA Part # M1A3P600-2FG484I
Description IC FPGA 235 I/O 484FBGA
Manufacturer Microsemi
Unit Price Request a Quote
In Stock 6,210
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Feb 19 - Feb 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

M1A3P600-2FG484I Resources

Brand Microsemi
ECAD Module ECAD
Mfr. Part NumberM1A3P600-2FG484I
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • M1A3P600-2FG484I Datasheet
  • where to find M1A3P600-2FG484I
  • Microsemi

  • Microsemi M1A3P600-2FG484I
  • M1A3P600-2FG484I PDF Datasheet
  • M1A3P600-2FG484I Stock

  • M1A3P600-2FG484I Pinout
  • Datasheet M1A3P600-2FG484I
  • M1A3P600-2FG484I Supplier

  • Microsemi Distributor
  • M1A3P600-2FG484I Price
  • M1A3P600-2FG484I Distributor

M1A3P600-2FG484I Specifications

ManufacturerMicrosemi Corporation
SeriesProASIC3
Number of LABs/CLBs-
Number of Logic Elements/Cells-
Total RAM Bits110592
Number of I/O235
Number of Gates600000
Voltage - Supply1.425V ~ 1.575V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case484-BGA
Supplier Device Package484-FPBGA (23x23)

The Products You May Be Interested In

A3P1000-1FG256M

Microsemi

Manufacturer

Microsemi Corporation

Series

ProASIC3

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

147456

Number of I/O

177

Number of Gates

1000000

Voltage - Supply

1.14V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

-55°C ~ 125°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FPBGA (17x17)

M1AFS1500-FGG676

Microsemi

Manufacturer

Microsemi Corporation

Series

Fusion®

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

276480

Number of I/O

252

Number of Gates

1500000

Voltage - Supply

1.425V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

676-BGA

Supplier Device Package

676-FBGA (27x27)

Manufacturer

Xilinx Inc.

Series

Kintex® UltraScale+™

Number of LABs/CLBs

65340

Number of Logic Elements/Cells

1143450

Total RAM Bits

82329600

Number of I/O

512

Number of Gates

-

Voltage - Supply

0.698V ~ 0.876V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1760-BBGA, FCBGA

Supplier Device Package

1760-FCBGA (42.5x42.5)

Manufacturer

Xilinx Inc.

Series

Kintex® UltraScale+™

Number of LABs/CLBs

37320

Number of Logic Elements/Cells

653100

Total RAM Bits

53964800

Number of I/O

464

Number of Gates

-

Voltage - Supply

0.698V ~ 0.876V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1156-BBGA, FCBGA

Supplier Device Package

1156-FCBGA (35x35)

Manufacturer

Intel

Series

Stratix® V GX

Number of LABs/CLBs

128300

Number of Logic Elements/Cells

340000

Total RAM Bits

23704576

Number of I/O

360

Number of Gates

-

Voltage - Supply

0.82V ~ 0.88V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

780-BBGA, FCBGA

Supplier Device Package

780-HBGA (33x33)

Recently Sold

VS-72CPQ030PBF

VS-72CPQ030PBF

Vishay Semiconductor Diodes Division

DIODE ARRAY SCHOTTKY 30V TO247AC

4N32SM

4N32SM

ON Semiconductor

OPTOISO 4.17KV DARL W/BASE 6SMD

MMSZ5232B-7-F

MMSZ5232B-7-F

Diodes Incorporated

DIODE ZENER 5.6V 500MW SOD123

IRFU9024NPBF

IRFU9024NPBF

Infineon Technologies

MOSFET P-CH 55V 11A I-PAK

MMBT5551LT1G

MMBT5551LT1G

ON Semiconductor

TRANS NPN 160V 0.6A SOT23

EPM1270F256C5N

EPM1270F256C5N

Intel

IC CPLD 980MC 6.2NS 256FBGA

PIC16F1705-I/P

PIC16F1705-I/P

Microchip Technology

IC MCU 8BIT 14KB FLASH 14DIP

W25X20CLSNIG

W25X20CLSNIG

Winbond Electronics

IC FLASH 2M SPI 104MHZ 8SOIC

HCPL-063L-500E

HCPL-063L-500E

Broadcom

OPTOISO 3.75KV 2CH OPEN COLL 8SO

DS1225AD-150IND

DS1225AD-150IND

Maxim Integrated

IC NVSRAM 64K PARALLEL 28EDIP

AD823AR

AD823AR

Analog Devices

IC OPAMP JFET 2 CIRCUIT 8SOIC

DSC1001DI5-024.0000

DSC1001DI5-024.0000

Microchip Technology

MEMS OSC XO 24.0000MHZ CMOS SMD