M1A3P1000L-FG256I
For Reference Only
| Part Number | M1A3P1000L-FG256I |
| PNEDA Part # | M1A3P1000L-FG256I |
| Description | IC FPGA 177 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 3,438 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1A3P1000L-FG256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1A3P1000L-FG256I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1A3P1000L-FG256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3L |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 147456 |
| Number of I/O | 177 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.14V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Microsemi Corporation Series ProASIC3L Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 516096 Number of I/O 221 Number of Gates 3000000 Voltage - Supply 1.14V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 324-BGA Supplier Device Package 324-FBGA (19x19) |
Manufacturer Intel Series FLEX 6000 Number of LABs/CLBs 132 Number of Logic Elements/Cells 1320 Total RAM Bits - Number of I/O 117 Number of Gates 16000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Xilinx Inc. Series Virtex® UltraScale+™ Number of LABs/CLBs 147780 Number of Logic Elements/Cells 2586150 Total RAM Bits 391168000 Number of I/O 832 Number of Gates - Voltage - Supply 0.825V ~ 0.876V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 2104-BBGA, FCBGA Supplier Device Package 2104-FCBGA (47.5x47.5) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 95 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
