EPF10K50VBC356-2
For Reference Only
| Part Number | EPF10K50VBC356-2 |
| PNEDA Part # | EPF10K50VBC356-2 |
| Description | IC FPGA 274 I/O 356BGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,670 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Feb 18 - Feb 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EPF10K50VBC356-2 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K50VBC356-2 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K50VBC356-2 Specifications
| Manufacturer | Intel |
| Series | FLEX-10K® |
| Number of LABs/CLBs | 360 |
| Number of Logic Elements/Cells | 2880 |
| Total RAM Bits | 20480 |
| Number of I/O | 274 |
| Number of Gates | 116000 |
| Voltage - Supply | 3V ~ 3.6V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 356-LBGA |
| Supplier Device Package | 356-BGA (35x35) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 784 Number of Logic Elements/Cells 1862 Total RAM Bits 25088 Number of I/O 145 Number of Gates 20000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-TQFP (24x24) |
Manufacturer Xilinx Inc. Series Kintex® UltraScale+™ Number of LABs/CLBs 20340 Number of Logic Elements/Cells 355950 Total RAM Bits 31641600 Number of I/O 280 Number of Gates - Voltage - Supply 0.698V ~ 0.876V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
