EPF10K30EFC256-1
For Reference Only
| Part Number | EPF10K30EFC256-1 |
| PNEDA Part # | EPF10K30EFC256-1 |
| Description | IC FPGA 176 I/O 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,724 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 3 - Apr 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EPF10K30EFC256-1 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K30EFC256-1 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K30EFC256-1 Specifications
| Manufacturer | Intel |
| Series | FLEX-10KE® |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements/Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of I/O | 176 |
| Number of Gates | 119000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Intel Series FLEX-10K® Number of LABs/CLBs 216 Number of Logic Elements/Cells 1728 Total RAM Bits 12288 Number of I/O 147 Number of Gates 69000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 208-BFQFP Exposed Pad Supplier Device Package 208-RQFP (28x28) |
Manufacturer Lattice Semiconductor Corporation Series CrossLink™ Number of LABs/CLBs 1484 Number of Logic Elements/Cells 5936 Total RAM Bits 184320 Number of I/O 17 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 36-UFBGA, WLCSP Supplier Device Package 36-WLCSP (2.54x2.59) |
Manufacturer Xilinx Inc. Series Virtex® Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 81920 Number of I/O 404 Number of Gates 468252 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 1563 Number of Logic Elements/Cells 25000 Total RAM Bits 691200 Number of I/O 101 Number of Gates - Voltage - Supply 2.85V ~ 3.465V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Exposed Pad Supplier Device Package 144-EQFP (20x20) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 500 Number of Logic Elements/Cells 8000 Total RAM Bits 387072 Number of I/O 178 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
