EPF10K30ABC356-1
For Reference Only
| Part Number | EPF10K30ABC356-1 |
| PNEDA Part # | EPF10K30ABC356-1 |
| Description | IC FPGA 246 I/O 356BGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 3,960 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 20 - Mar 25 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EPF10K30ABC356-1 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K30ABC356-1 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K30ABC356-1 Specifications
| Manufacturer | Intel |
| Series | FLEX-10KA® |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements/Cells | 1728 |
| Total RAM Bits | 12288 |
| Number of I/O | 246 |
| Number of Gates | 69000 |
| Voltage - Supply | 3V ~ 3.6V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 356-LBGA |
| Supplier Device Package | 356-BGA (35x35) |
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Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 147456 Number of I/O 97 Number of Gates 1000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LBGA Supplier Device Package 144-FPBGA (13x13) |
Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 1024 Number of Logic Elements/Cells 2432 Total RAM Bits 32768 Number of I/O 160 Number of Gates 28000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Exposed Pad Supplier Device Package 208-PQFP (28x28) |
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Manufacturer Xilinx Inc. Series Kintex®-7 Number of LABs/CLBs 25475 Number of Logic Elements/Cells 326080 Total RAM Bits 16404480 Number of I/O 400 Number of Gates - Voltage - Supply 0.97V ~ 1.03V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
