EPF10K130EBC356-2
For Reference Only
| Part Number | EPF10K130EBC356-2 |
| PNEDA Part # | EPF10K130EBC356-2 |
| Description | IC FPGA 274 I/O 356BGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 4,284 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 2 - Apr 7 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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EPF10K130EBC356-2 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K130EBC356-2 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K130EBC356-2 Specifications
| Manufacturer | Intel |
| Series | FLEX-10KE® |
| Number of LABs/CLBs | 832 |
| Number of Logic Elements/Cells | 6656 |
| Total RAM Bits | 65536 |
| Number of I/O | 274 |
| Number of Gates | 342000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 356-LBGA |
| Supplier Device Package | 356-BGA (35x35) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 3136 Number of Logic Elements/Cells 7448 Total RAM Bits 100352 Number of I/O 448 Number of Gates 85000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
