EPF10K100EBC356-3
For Reference Only
| Part Number | EPF10K100EBC356-3 |
| PNEDA Part # | EPF10K100EBC356-3 |
| Description | IC FPGA 274 I/O 356BGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 8,658 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 21 - Mar 26 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EPF10K100EBC356-3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K100EBC356-3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K100EBC356-3 Specifications
| Manufacturer | Intel |
| Series | FLEX-10KE® |
| Number of LABs/CLBs | 624 |
| Number of Logic Elements/Cells | 4992 |
| Total RAM Bits | 49152 |
| Number of I/O | 274 |
| Number of Gates | 257000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 356-LBGA |
| Supplier Device Package | 356-BGA (35x35) |
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Manufacturer Xilinx Inc. Series * Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits - Number of I/O - Number of Gates - Voltage - Supply - Mounting Type - Operating Temperature - Package / Case - Supplier Device Package - |
Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 56340 Total RAM Bits 1869824 Number of I/O 377 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
