EP4CE22F17C9L
For Reference Only
| Part Number | EP4CE22F17C9L |
| PNEDA Part # | EP4CE22F17C9L |
| Description | IC FPGA 153 I/O 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,508 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 29 - Dec 4 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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EP4CE22F17C9L Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP4CE22F17C9L |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP4CE22F17C9L Specifications
| Manufacturer | Intel |
| Series | Cyclone® IV E |
| Number of LABs/CLBs | 1395 |
| Number of Logic Elements/Cells | 22320 |
| Total RAM Bits | 608256 |
| Number of I/O | 153 |
| Number of Gates | - |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Intel Series Cyclone® IV E Number of LABs/CLBs 963 Number of Logic Elements/Cells 15408 Total RAM Bits 516096 Number of I/O 165 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Intel Series Cyclone® Number of LABs/CLBs 2006 Number of Logic Elements/Cells 20060 Total RAM Bits 294912 Number of I/O 301 Number of Gates - Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 400-BGA Supplier Device Package 400-FBGA (21x21) |
Manufacturer Xilinx Inc. Series Spartan®-6 LXT Number of LABs/CLBs 3411 Number of Logic Elements/Cells 43661 Total RAM Bits 2138112 Number of I/O 296 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 154 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Intel Series APEX-20KE® Number of LABs/CLBs 832 Number of Logic Elements/Cells 8320 Total RAM Bits 106496 Number of I/O 376 Number of Gates 526000 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
