EP3C25F256C8
For Reference Only
| Part Number | EP3C25F256C8 |
| PNEDA Part # | EP3C25F256C8 |
| Description | IC FPGA 156 I/O 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 6,174 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 16 - Mar 21 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP3C25F256C8 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP3C25F256C8 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP3C25F256C8 Specifications
| Manufacturer | Intel |
| Series | Cyclone® III |
| Number of LABs/CLBs | 1539 |
| Number of Logic Elements/Cells | 24624 |
| Total RAM Bits | 608256 |
| Number of I/O | 156 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Xilinx Inc. Series Kintex® UltraScale™ Number of LABs/CLBs 82920 Number of Logic Elements/Cells 1451100 Total RAM Bits 77721600 Number of I/O 624 Number of Gates - Voltage - Supply 0.880V ~ 0.979V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FCBGA (40x40) |
