EP2SGX60EF1152C3
For Reference Only
| Part Number | EP2SGX60EF1152C3 |
| PNEDA Part # | EP2SGX60EF1152C3 |
| Description | IC FPGA 534 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 6,462 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 25 - Nov 30 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP2SGX60EF1152C3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2SGX60EF1152C3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2SGX60EF1152C3 Specifications
| Manufacturer | Intel |
| Series | Stratix® II GX |
| Number of LABs/CLBs | 3022 |
| Number of Logic Elements/Cells | 60440 |
| Total RAM Bits | 2544192 |
| Number of I/O | 534 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Intel Series APEX-20KC® Number of LABs/CLBs 3840 Number of Logic Elements/Cells 38400 Total RAM Bits 327680 Number of I/O 488 Number of Gates 1772000 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 652-BBGA Supplier Device Package 652-BGA (45x45) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 1563 Number of Logic Elements/Cells 25000 Total RAM Bits 691200 Number of I/O 178 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Lattice Semiconductor Corporation Series SCM Number of LABs/CLBs 6250 Number of Logic Elements/Cells 25000 Total RAM Bits 1966080 Number of I/O 378 Number of Gates - Voltage - Supply 0.95V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FPBGA (31x31) |
