EP2SGX130GF40C4NES
For Reference Only
| Part Number | EP2SGX130GF40C4NES |
| PNEDA Part # | EP2SGX130GF40C4NES |
| Description | IC FPGA 734 I/O 1508FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 6,660 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 23 - Mar 28 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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EP2SGX130GF40C4NES Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2SGX130GF40C4NES |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2SGX130GF40C4NES Specifications
| Manufacturer | Intel |
| Series | Stratix® II GX |
| Number of LABs/CLBs | 6627 |
| Number of Logic Elements/Cells | 132540 |
| Total RAM Bits | 6747840 |
| Number of I/O | 734 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1508-BBGA, FCBGA |
| Supplier Device Package | 1508-FBGA (30x30) |
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Manufacturer Intel Series Stratix® II Number of LABs/CLBs 3022 Number of Logic Elements/Cells 60440 Total RAM Bits 2544192 Number of I/O 334 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Intel Series ACEX-1K® Number of LABs/CLBs 216 Number of Logic Elements/Cells 1728 Total RAM Bits 24576 Number of I/O 171 Number of Gates 119000 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 256-BBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Xilinx Inc. Series Spartan®-3E Number of LABs/CLBs 2168 Number of Logic Elements/Cells 19512 Total RAM Bits 516096 Number of I/O 250 Number of Gates 1200000 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 320-BGA Supplier Device Package 320-FBGA (19x19) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 65 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Xilinx Inc. Series Automotive, AEC-Q100, Artix-7 XA Number of LABs/CLBs 4075 Number of Logic Elements/Cells 52160 Total RAM Bits 2764800 Number of I/O 210 Number of Gates - Voltage - Supply 0.95V ~ 1.05V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 324-LFBGA, CSPBGA Supplier Device Package 324-CSPBGA (15x15) |
