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EP2AGX45DF29I3NAD

EP2AGX45DF29I3NAD

For Reference Only

Part Number EP2AGX45DF29I3NAD
PNEDA Part # EP2AGX45DF29I3NAD
Description IC FPGA 364 I/O 780FBGA
Manufacturer Intel
Unit Price Request a Quote
In Stock 8,136
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Mar 19 - Mar 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

EP2AGX45DF29I3NAD Resources

Brand Intel
ECAD Module ECAD
Mfr. Part NumberEP2AGX45DF29I3NAD
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)

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EP2AGX45DF29I3NAD Specifications

ManufacturerIntel
SeriesArria II GX
Number of LABs/CLBs1805
Number of Logic Elements/Cells42959
Total RAM Bits3517440
Number of I/O364
Number of Gates-
Voltage - Supply0.87V ~ 0.93V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case780-BBGA, FCBGA
Supplier Device Package780-FBGA (29x29)

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Manufacturer

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Series

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Number of LABs/CLBs

1805

Number of Logic Elements/Cells

42959

Total RAM Bits

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Number of I/O

156

Number of Gates

-

Voltage - Supply

0.87V ~ 0.93V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

358-LFBGA, FCBGA

Supplier Device Package

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Lattice Semiconductor Corporation

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Series

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Number of LABs/CLBs

264

Number of Logic Elements/Cells

2112

Total RAM Bits

75776

Number of I/O

206

Number of Gates

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Voltage - Supply

1.14V ~ 1.26V

Mounting Type

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Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

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Supplier Device Package

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Manufacturer

Xilinx Inc.

Series

Virtex®-7 XT

Number of LABs/CLBs

54150

Number of Logic Elements/Cells

693120

Total RAM Bits

54190080

Number of I/O

350

Number of Gates

-

Voltage - Supply

0.97V ~ 1.03V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1156-BBGA, FCBGA

Supplier Device Package

1158-FCBGA (35x35)

LFSC3GA40E-6FFN1152I

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

SC

Number of LABs/CLBs

10000

Number of Logic Elements/Cells

40000

Total RAM Bits

4075520

Number of I/O

604

Number of Gates

-

Voltage - Supply

0.95V ~ 1.26V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 105°C (TJ)

Package / Case

1152-BBGA

Supplier Device Package

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A3P600L-FG144

Microsemi

Manufacturer

Microsemi Corporation

Series

ProASIC3L

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

110592

Number of I/O

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Number of Gates

600000

Voltage - Supply

1.14V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

144-LBGA

Supplier Device Package

144-FPBGA (13x13)

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