EP2AGX45DF29I3NAD
For Reference Only
| Part Number | EP2AGX45DF29I3NAD |
| PNEDA Part # | EP2AGX45DF29I3NAD |
| Description | IC FPGA 364 I/O 780FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 8,136 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 19 - Mar 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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EP2AGX45DF29I3NAD Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2AGX45DF29I3NAD |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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EP2AGX45DF29I3NAD Specifications
| Manufacturer | Intel |
| Series | Arria II GX |
| Number of LABs/CLBs | 1805 |
| Number of Logic Elements/Cells | 42959 |
| Total RAM Bits | 3517440 |
| Number of I/O | 364 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29x29) |
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Manufacturer Intel Series Arria II GX Number of LABs/CLBs 1805 Number of Logic Elements/Cells 42959 Total RAM Bits 3517440 Number of I/O 156 Number of Gates - Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 358-LFBGA, FCBGA Supplier Device Package 358-UBGA, FC (17x17) |
Manufacturer Microsemi Corporation Series ProASIC3L Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 97 Number of Gates 600000 Voltage - Supply 1.14V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LBGA Supplier Device Package 144-FPBGA (13x13) |
Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 146124 Total RAM Bits 5120000 Number of I/O 574 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FCBGA (35x35) |
Manufacturer Lattice Semiconductor Corporation Series MachXO2 Number of LABs/CLBs 264 Number of Logic Elements/Cells 2112 Total RAM Bits 75776 Number of I/O 206 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FTBGA (17x17) |
Manufacturer Xilinx Inc. Series Automotive, AEC-Q100, Spartan®-3E XA Number of LABs/CLBs 8672 Number of Logic Elements/Cells 19512 Total RAM Bits 516096 Number of I/O 190 Number of Gates 1200000 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FTBGA (17x17) |
