EP2AGX125DF25I3N
For Reference Only
| Part Number | EP2AGX125DF25I3N |
| PNEDA Part # | EP2AGX125DF25I3N |
| Description | IC FPGA 260 I/O 572FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 3,366 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 18 - Mar 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP2AGX125DF25I3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2AGX125DF25I3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2AGX125DF25I3N Specifications
| Manufacturer | Intel |
| Series | Arria II GX |
| Number of LABs/CLBs | 4964 |
| Number of Logic Elements/Cells | 118143 |
| Total RAM Bits | 8315904 |
| Number of I/O | 260 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 572-BGA, FCBGA |
| Supplier Device Package | 572-FBGA, FC (25x25) |
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Manufacturer Lattice Semiconductor Corporation Series XP Number of LABs/CLBs - Number of Logic Elements/Cells 6000 Total RAM Bits 73728 Number of I/O 188 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-BGA Supplier Device Package 256-FPBGA (17x17) |
