EP2AGX125DF25C6
For Reference Only
| Part Number | EP2AGX125DF25C6 |
| PNEDA Part # | EP2AGX125DF25C6 |
| Description | IC FPGA 260 I/O 572FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 2,268 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 4 - Apr 9 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP2AGX125DF25C6 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2AGX125DF25C6 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2AGX125DF25C6 Specifications
| Manufacturer | Intel |
| Series | Arria II GX |
| Number of LABs/CLBs | 4964 |
| Number of Logic Elements/Cells | 118143 |
| Total RAM Bits | 8315904 |
| Number of I/O | 260 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 572-BGA, FCBGA |
| Supplier Device Package | 572-FBGA, FC (25x25) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 324 Number of Logic Elements/Cells 770 Total RAM Bits 10368 Number of I/O 129 Number of Gates 8000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 160-BQFP Supplier Device Package 160-PQFP (28x28) |
Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 147456 Number of I/O 154 Number of Gates 1000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
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Manufacturer Microsemi Corporation Series ProASIC3E Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 147 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
