EP20K30EFC256-3
For Reference Only
| Part Number | EP20K30EFC256-3 |
| PNEDA Part # | EP20K30EFC256-3 |
| Description | IC FPGA 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 4,158 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 31 - Apr 5 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP20K30EFC256-3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP20K30EFC256-3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP20K30EFC256-3 Specifications
| Manufacturer | Intel |
| Series | APEX-20KE® |
| Number of LABs/CLBs | 120 |
| Number of Logic Elements/Cells | 1200 |
| Total RAM Bits | 24576 |
| Number of I/O | - |
| Number of Gates | 113000 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Microsemi Corporation Series PolarFire™ Number of LABs/CLBs - Number of Logic Elements/Cells 300000 Total RAM Bits 21094400 Number of I/O 512 Number of Gates - Voltage - Supply 0.97V ~ 1.08V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1152-BBGA Supplier Device Package 1152-FCBGA (35x35) |
Manufacturer Intel Series APEX-20KE® Number of LABs/CLBs 416 Number of Logic Elements/Cells 4160 Total RAM Bits 53248 Number of I/O 93 Number of Gates 263000 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-BGA Supplier Device Package 144-FBGA (13x13) |
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Manufacturer Xilinx Inc. Series Virtex® Number of LABs/CLBs 3456 Number of Logic Elements/Cells 15552 Total RAM Bits 98304 Number of I/O 316 Number of Gates 661111 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 432-LBGA Exposed Pad, Metal Supplier Device Package 432-MBGA (40x40) |
