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BR25A512FJ-3MGE2

BR25A512FJ-3MGE2

For Reference Only

Part Number BR25A512FJ-3MGE2
PNEDA Part # BR25A512FJ-3MGE2
Description 105°C OPERATION SPI BUS EEPR
Manufacturer Rohm Semiconductor
Unit Price Request a Quote
In Stock 5,526
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Nov 24 - Nov 29 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

BR25A512FJ-3MGE2 Resources

Brand Rohm Semiconductor
ECAD Module ECAD
Mfr. Part NumberBR25A512FJ-3MGE2
CategorySemiconductorsMemory ICsMemory
Datasheet
BR25A512FJ-3MGE2, BR25A512FJ-3MGE2 Datasheet (Total Pages: 32, Size: 831.76 KB)
PDFBR25A512FJ-3MGE2 Datasheet Cover
BR25A512FJ-3MGE2 Datasheet Page 2 BR25A512FJ-3MGE2 Datasheet Page 3 BR25A512FJ-3MGE2 Datasheet Page 4 BR25A512FJ-3MGE2 Datasheet Page 5 BR25A512FJ-3MGE2 Datasheet Page 6 BR25A512FJ-3MGE2 Datasheet Page 7 BR25A512FJ-3MGE2 Datasheet Page 8 BR25A512FJ-3MGE2 Datasheet Page 9 BR25A512FJ-3MGE2 Datasheet Page 10 BR25A512FJ-3MGE2 Datasheet Page 11

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BR25A512FJ-3MGE2 Specifications

ManufacturerRohm Semiconductor
Series-
Memory TypeNon-Volatile
Memory FormatEEPROM
TechnologyEEPROM
Memory Size512Kb (64K x 8)
Memory InterfaceSPI
Clock Frequency10MHz
Write Cycle Time - Word, Page5ms
Access Time-
Voltage - Supply2.5V ~ 5.5V
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case8-SOIC (0.154", 3.90mm Width)
Supplier Device Package8-SOP-J

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