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BCM58522BB0KF12G

BCM58522BB0KF12G

For Reference Only

Part Number BCM58522BB0KF12G
PNEDA Part # BCM58522BB0KF12G
Description DUAL CORE
Manufacturer Broadcom
Unit Price Request a Quote
In Stock 6,444
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Apr 4 - Apr 9 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

BCM58522BB0KF12G Resources

Brand Broadcom
ECAD Module ECAD
Mfr. Part NumberBCM58522BB0KF12G
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors

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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
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BCM58522BB0KF12G Specifications

ManufacturerBroadcom Limited
Series*
Core Processor-
Number of Cores/Bus Width-
Speed-
Co-Processors/DSP-
RAM Controllers-
Graphics Acceleration-
Display & Interface Controllers-
Ethernet-
SATA-
USB-
Voltage - I/O-
Operating Temperature-
Security Features-
Package / Case-
Supplier Device Package-

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Series

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Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000Mbps (1)

SATA

SATA 3Gbps (1)

USB

USB 2.0 + PHY (4)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-20°C ~ 105°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

624-LFBGA, FCBGA

Supplier Device Package

624-FCPBGA (21x21)

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300c3

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

267MHz

Co-Processors/DSP

Security; SEC 2.2

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

USB 2.0 + PHY (1)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 105°C (TA)

Security Features

Cryptography

Package / Case

516-BBGA Exposed Pad

Supplier Device Package

516-TEPBGA (27x27)

Manufacturer

NXP USA Inc.

Series

Vybrid, VF3xxR

Core Processor

ARM® Cortex®-A5 + Cortex®-M4

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

266MHz, 133MHz

Co-Processors/DSP

Multimedia; NEON™ MPE

RAM Controllers

LPDDR2, DDR3, DRAM

Graphics Acceleration

No

Display & Interface Controllers

DCU, GPU, LCD, VideoADC, VIU

Ethernet

10/100Mbps (2)

SATA

-

USB

USB 2.0 OTG + PHY (1)

Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 85°C (TA)

Security Features

ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG

Package / Case

176-LQFP Exposed Pad

Supplier Device Package

176-LQFP-EP (24x24)

TSPC603RVGS12LC

Microchip Technology

Manufacturer

Microchip Technology

Series

-

Core Processor

PowerPC 603e

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

266MHz

Co-Processors/DSP

-

RAM Controllers

-

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

-

SATA

-

USB

-

Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 110°C (TC)

Security Features

-

Package / Case

255-BCBGA Exposed Pad

Supplier Device Package

255-CI-CGA (21x21)

Manufacturer

NXP USA Inc.

Series

i.MX25

Core Processor

ARM926EJ-S

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

400MHz

Co-Processors/DSP

-

RAM Controllers

LPDDR, DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (2)

Voltage - I/O

2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Operating Temperature

-20°C ~ 70°C (TA)

Security Features

-

Package / Case

400-LFBGA

Supplier Device Package

400-MAPBGA (17x17)

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